File:Through-Silicon Via Flavours.svg
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Summary
| Description |
English: The main process or implementation flavours for through-silicon vias (TSVs). Via-first TSVs are fabricated before the active layers (front-end-of-line, FEOL); via-middle TSVs are fabricated after the FEOL but before the metal layers (back-end-of-line, BEOL); via-last TSVs are fabricated after (or during) the BEOL process. |
| Date | |
| Source | Own work |
| Author | Jknechtel |
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File history
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 20:57, 5 December 2017 | | 560 × 309 (148 KB) | wikimediacommons>Jknechtel | Minor fixes regarding colors and transparency of various elements in SVG |
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