File:Pad Cratering 02.jpg

From Vigyanwiki

Pad_Cratering_02.jpg ‎(387 × 292 pixels, file size: 10 KB, MIME type: image/jpeg)

This file is from Wikimedia Commons and may be used by other projects. The description on its file description page there is shown below.

Summary

Description
English: Magnified view of cross section of BGA pad and solder ball. Dielectric has cracked and starting the pad to lift. Eventually creating pad cratering.
Date
Source Integral Technology, Lake Forest, CA
Author Chris Hunrath

Licensing

© The copyright holder of this file allows anyone to use it for any purpose, provided that the copyright holder is properly attributed. Redistribution, derivative work, commercial use, and all other use is permitted.

Captions

Add a one-line explanation of what this file represents

Items portrayed in this file

depicts

inception

1 August 2010

media type

image/jpeg

File history

Click on a date/time to view the file as it appeared at that time.

Date/TimeThumbnailDimensionsUserComment
current06:13, 9 November 2010Thumbnail for version as of 06:13, 9 November 2010387 × 292 (10 KB)wikimediacommons>Rockyh2{{Information |Description={{en|1=Magnified view of cross section of BGA pad and solder ball. Dielectric has cracked and starting the pad to lift. Eventually creating pad cratering.}} |Source=Integral Technology, Lake Forest, CA |Author=Chris Hunrath |Dat

The following page uses this file:

Metadata

This file contains additional information, probably added from the digital camera or scanner used to create or digitise it.

If the file has been modified from its original state, some details may not fully reflect the modified file.

Retrieved from ‘https://www.vigyanwiki.in/wiki/File:Pad_Cratering_02.jpg’