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English: Schematic showing different scenarios in electroplating. (a) faster deposition rate at the top, (b) uniform deposition rate and (c) faster deposition rate at the bottom (superfill).
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Jhothiraman, J.K. and Balachandran, R. (2019) Electroplating: Applications in the Semiconductor Industry. Advances in Chemical Engineering and Science, 9, 239-261. https://doi.org/10.4236/aces.2019.92018
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Fig.A. Schematic showing different scenarios in electroplating. (a) faster deposition rate at the top, (b) uniform deposition rate and (c) faster deposition rate at the bottom (superfill).